Composite electronic component and board having the same

ABSTRACT

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is the divisional application of U.S. patentapplication Ser. No. 16/691,787 filed on Nov. 22, 2019, which is acontinuation application of U.S. patent application Ser. No. 15/959,993filed on Apr. 23, 2018, which claims the benefit of priority to KoreanPatent Application No. 10-2017-0106216 filed on Aug. 22, 2017 in theKorean Intellectual Property Office, the disclosures of which areincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a composite electronic component and aboard having the same.

BACKGROUND

A multilayer ceramic capacitor, a multilayer electronic component, is achip type condenser mounted on the circuit boards of various electronicproducts, such as display devices, including liquid crystal displays(LCDs), plasma display panels (PDPs), or the like, computers, personaldigital assistants (PDAs), mobile phones, and the like, to serve tocharge electricity or discharge electricity.

This multilayer ceramic capacitor (MLCC) may be used as a component invarious electronic apparatuses due to advantages such as a small size,high capacitance, and ease of mountability.

The multilayer ceramic capacitor may have a structure in which aplurality of dielectric layers and internal electrodes disposed betweenthe dielectric layers and having different polarities are alternatelystacked.

Since the dielectric layer as described above has piezoelectricity andelectrostriction, when a direct current (DC) or alternating current (AC)voltage is applied to the multilayer ceramic capacitor, a piezoelectricphenomenon may occur between the internal electrodes, thereby generatingvibrations.

These vibrations are transferred to a circuit board on which themultilayer ceramic capacitor is mounted through external electrodes ofthe multilayer ceramic capacitor, such that an entire circuit boardbecomes a sound reflecting surface to transmit the sound of vibrationsas noise.

The sound of vibrations may correspond to an audio frequency range of 20to 20,000 Hz potentially causing user discomfort. The vibration noisecausing listener discomfort as described above is called acoustic noise.

In accordance with the recent trend toward slimness and miniaturizationof electronic devices, the multilayer ceramic capacitor has been usedtogether with a printed circuit board in an environment of high voltageand large voltage change, and thus, the acoustic noise may besufficiently recognized by a user.

Therefore, a novel product capable of decreasing acoustic noise has beencontinuously demanded.

Meanwhile, research into a composite electronic component in which aprinted circuit board was used below a multilayer ceramic capacitor inorder to decrease acoustic noise has been conducted.

However, specific research into a degree of removal of acoustic noisedepending on a size and a mounting method of the multilayer ceramiccapacitor and a thickness of a ceramic chip disposed on a lower portionof the multilayer ceramic capacitor has not been sufficiently conducted.

SUMMARY

An aspect of the present disclosure may provide a composite electroniccomponent capable of decreasing acoustic noise, a board having the same.

According to an aspect of the present disclosure, a composite electroniccomponent may include a composite body in which a multilayer ceramiccapacitor and a ceramic chip are coupled to each other, the multilayerceramic capacitor including a first ceramic body in which a plurality ofdielectric layers and internal electrodes disposed to face each otherwith respective dielectric layers interposed therebetween are stacked,and first and second external electrodes disposed on both end portionsof the first ceramic body, and the ceramic chip being disposed on alower portion of the multilayer ceramic capacitor and formed of aceramic material containing alumina (Al₂O₃), wherein T/L≥0.22 in which Lis a length L of the multilayer ceramic capacitor and T is a thicknessof the ceramic chip.

According to another aspect of the present disclosure, a board having acomposite electronic component may include: a printed circuit board onwhich a plurality of electrode pads are formed; the composite electroniccomponent as described above, mounted on the printed circuit board; anda solder connecting the electrode pads and the composite electroniccomponent to each other.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to a first exemplary embodiment in thepresent disclosure;

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1;

FIG. 3 is a partially cut-away perspective view schematicallyillustrating a multilayer ceramic capacitor according to a secondexemplary embodiment in the present disclosure in the compositeelectronic component of FIG. 1;

FIG. 4 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of the compositeelectronic component of FIG. 1;

FIG. 5 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of another example ofthe composite electronic component of FIG. 1;

FIG. 6 is a perspective view schematically illustrating a compositeelectronic component according to a third exemplary embodiment of thepresent disclosure;

FIG. 7 is a perspective view schematically illustrating a compositeelectronic component according to a fourth exemplary embodiment in thepresent disclosure;

FIG. 8 is a perspective view schematically illustrating a compositeelectronic component according to a fifth exemplary embodiment in thepresent disclosure;

FIG. 9 is a perspective view illustrating aboard in which the compositeelectronic component of FIG. 1 is mounted on a printed circuit boar; and

FIG. 10 is a cross-sectional view taken along line II-II′ of FIG. 9.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will now bedescribed in detail with reference to the accompanying drawings. In theaccompanying drawings, shapes, sizes, and the like, of components may beexaggerated or stylized for clarity.

The present disclosure may, however, be exemplified in many differentforms and should not be construed as being limited to the specificembodiments set forth herein. Rather these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the disclosure to those skilled in the art.

The term “an exemplary embodiment” used herein does not refer to thesame exemplary embodiment, and is provided to emphasize a particularfeature or characteristic different from that of another exemplaryembodiment. However, exemplary embodiments provided herein areconsidered to be able to be implemented by being combined in whole or inpart one with another. For example, one element described in aparticular exemplary embodiment, even if it is not described in anotherexemplary embodiment, may be understood as a description related toanother exemplary embodiment, unless an opposite or contradictorydescription is provided therein.

The meaning of a “connection” of a component to another component in thedescription includes an indirect connection through a third component aswell as a direct connection between two components. In addition,“electrically connected” means the concept including a physicalconnection and a physical disconnection. It can be understood that whenan element is referred to with “first” and “second”, the element is notlimited thereby. They may be used only for a purpose of distinguishingthe element from the other elements, and may not limit the sequence orimportance of the elements. In some cases, a first element may bereferred to as a second element without departing from the scope of theclaims set forth herein. Similarly, a second element may also bereferred to as a first element.

Herein, an upper portion, a lower portion, an upper side, a lower side,an upper surface, a lower surface, and the like, are decided in theaccompanying drawings. For example, a first connection member isdisposed on a level above a redistribution layer. However, the claimsare not limited thereto. In addition, a vertical direction refers to theabovementioned upward and downward directions, and a horizontaldirection refers to a direction perpendicular to the abovementionedupward and downward directions. In this case, a vertical cross sectionrefers to a case taken along a plane in the vertical direction, and anexample thereof may be a cross-sectional view illustrated in thedrawings. In addition, a horizontal cross section refers to a case takenalong a plane in the horizontal direction, and an example thereof may bea plan view illustrated in the drawings.

Terms used herein are used only in order to describe an exemplaryembodiment rather than limiting the present disclosure. In this case,singular forms include plural forms unless interpreted otherwise incontext.

Composite Electronic Component

FIG. 1 is a perspective view schematically illustrating a compositeelectronic component according to a first exemplary embodiment in thepresent disclosure.

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1.

Referring to FIG. 1, in the composite electronic component according tothe exemplary embodiment in the present disclosure, a ‘length direction’refers to an ‘L’ direction of FIG. 1, a ‘width direction’ refers to a‘W’ direction of FIG. 1, and a ‘thickness direction’ refers to a ‘T’direction of FIG. 1. Here, the ‘thickness direction’ may be the same asa direction in which dielectric layers of a capacitor are stacked, thatis, a ‘stacking direction’.

Meanwhile, in the exemplary embodiment in the present disclosure, thecomposite electronic component may have upper and lower surfacesopposing each other, first and second end surfaces in the lengthdirection and third and fourth side surfaces in the width direction thatconnect the upper and lower surfaces to each other. A shape of thecomposite electronic component is not particularly limited, but may be ahexahedral shape as illustrated.

Meanwhile, in the composite electronic component, a multilayer ceramiccapacitor and a ceramic chip may be coupled to each other, and in a casein which the ceramic chip is coupled to a lower portion of themultilayer ceramic capacitor, the upper surface of the compositeelectronic component may be defined as an upper surface of themultilayer ceramic capacitor, and a lower surface of the compositeelectronic component may be defined as a lower surface of the ceramicchip.

In addition, the first and second end surfaces of the compositeelectronic component in the length direction and the third and fourthside surfaces thereof in the width direction may be defined as surfacesin the same directions as directions of first and second end surfaces ofthe multilayer ceramic capacitor and the ceramic chip in the lengthdirection and third and fourth side surfaces of the multilayer ceramiccapacitor and the ceramic chip in the width direction, respectively, asdescribed below.

Referring to FIGS. 1 and 2, the composite electronic component accordingto the first exemplary embodiment in the present disclosure may includea composite body 300 in which a multilayer ceramic capacitor 100 and aceramic chip 200 are coupled to each other, wherein the multilayerceramic capacitor 100 includes a first ceramic body 110 in which aplurality of dielectric layers and internal electrodes 121 and 122disposed to face each other with respective dielectric layers interposedtherebetween are stacked, and first and second external electrodes 131and 132 disposed on both end portions of the first ceramic body 110, andthe ceramic chip 200 is disposed on a lower portion of the multilayerceramic capacitor 100 and formed of a ceramic material containing, forexample, alumina (Al₂O₃).

According to the exemplary embodiment in the present disclosure, theceramic chip 200 may include a second ceramic body 210 formed of theceramic material containing, for example, alumina (Al₂O₃) and first andsecond terminal electrodes 211 and 212 disposed on both end portions ofthe second ceramic body 210 and connected to first and second externalelectrodes 131 and 132, respectively.

The ceramic material may contain alumina (Al₂O₃).

In general, in order to significantly decrease the transferring ofvibration of a multilayer ceramic capacitor to a printed circuit board,there have been attempts to insert an intermediate medium between themultilayer ceramic capacitor and the printed circuit board.

However, since the intermediate medium is formed of a material havingelasticity as a resin generally used to manufacture a printed circuitboard, the intermediate medium may serve to absorb vibrations of themultilayer ceramic capacitor through elasticity of the intermediatemedium.

On the contrary, according to the first exemplary embodiment in thepresent disclosure, since the second ceramic body 210 of the ceramicchip 200 is formed of a hard ceramic material, for example, containingalumina (Al₂O₃) that is not elastically deformed, the printed circuitboard and the multilayer ceramic capacitor 100 may be spaced apart fromeach other by the ceramic chip 200, thereby blocking vibration generatedin the multilayer ceramic capacitor 100 from being transferred to theboard.

According to the exemplary embodiment in the present disclosure, alength L of the multilayer ceramic capacitor 100 and a thickness T ofthe ceramic chip 200 may satisfy T/L≥0.22.

According to the related art, research into a composite electroniccomponent in which a printed circuit board was used on a lower surfaceof a multilayer ceramic capacitor in order to decrease acoustic noisehas been conducted. However, specific research into a degree of removalof acoustic noise depending on a size and a mounting method of themultilayer ceramic capacitor and a thickness of a ceramic chip disposedon a lower portion of the multilayer ceramic capacitor has not beensufficiently conducted. Therefore, research for finding the criticalpoint with respect to an influence of acoustic noise depending on thesize and the mounting method of the multilayer ceramic capacitor, andthe thickness of the ceramic chip disposed on the lower portion of themultilayer ceramic capacitor has been required. According to theexemplary embodiment in the present disclosure, a numerical value forthe critical point as described above may be provided.

More specifically, in the exemplary embodiment in the presentdisclosure, a thickness of the ceramic chip 200 at which acoustic noiseis significantly decreased may be provided depending on the size of themultilayer ceramic capacitor 100 by adjusting the length L of themultilayer ceramic capacitor 100 and the thickness T of the ceramic chip200 so as to satisfy T/L≥0.22.

That is, the influence of acoustic noise generated in the multilayerceramic capacitor 100 may be significantly decreased by adjusting thelength L of the multilayer ceramic capacitor 100 and the thickness T ofthe ceramic chip 200 so as to satisfy T/L≥0.22.

When the ratio (T/L) of the thickness T of the ceramic chip 200 to thelength L of the multilayer ceramic capacitor 100 is less than 0.22, aneffect of decreasing acoustic noise may be insufficient. Further, eventhough the ratio is constant, the effect of decreasing acoustic noisemay be insufficient depending on a mounting method of the ceramic chip200.

In the exemplary embodiment in the present disclosure, the length of themultilayer ceramic capacitor 100 may be 2.0 mm or more.

That is, in the composite electronic component according to theexemplary embodiment in the present disclosure, the multilayer ceramiccapacitor may be applied to a product having a length of at least 2.0 mmor more rather than a miniaturized component.

For example, in the exemplary embodiment in the present disclosure, themultilayer ceramic capacitor 100 may have a2012 size (length×width: 2.0mm×1.2 mm), or a 3216 size (length×width: 3.2 mm×1.6 mm) or more.

A composite electronic component in which a ceramic chip was disposed ona lower portion of a multilayer ceramic capacitor in order to decreaseacoustic noise, the multilayer ceramic capacitor had a size equal to orsmaller than a 1608 size (length×width: 1.6 mm×0.8 mm), for example, a1005 size (length×width: 1.0 mm×0.5 mm) or less has been attempted.

According to the exemplary embodiment in the present disclosure, in acase of the multilayer ceramic capacitor that does not have a small sizebut has a length of at least 2.0 mm or more, a range of the thickness ofthe ceramic chip with respect to the length of the multilayer ceramiccapacitor in which acoustic noise is significantly decreased may beprovided.

The thickness of the ceramic chip 200 may be 0.5 mm or more. That is,according to the exemplary embodiment in the present disclosure, in acase in which the length of the multilayer ceramic capacitor 100 is atleast 2.0 mm or more, only when the thickness of the ceramic chip 200 atwhich acoustic noise is significantly decreased is at least 0.5 mm ormore, the effect of the present disclosure may be implemented. However,the thickness of the ceramic chip is not necessarily limited thereto.

On the contrary, when the thickness of the ceramic chip 200 is less than0.5 mm, the effect of decreasing acoustic noise may be insufficient.

Hereinafter, the multilayer ceramic capacitor 100 and the ceramic chip200 configuring the composite body 300 will be described in detail.

Referring to FIG. 2, the first ceramic body 110 configuring themultilayer ceramic capacitor 100 may be formed by stacking the pluralityof dielectric layers 111, and a plurality of internal electrodes 121 and122 (sequential first and second internal electrodes) may be disposed inthe first ceramic body 110 to be separated from each other withrespective dielectric layers 111 interposed therebetween.

The plurality of dielectric layers 111 configuring the first ceramicbody 110 may be in a sintered state, and adjacent dielectric layers 111may be integrated with each other so that boundaries therebetween maynot be readily apparent.

The dielectric layer 111 may be formed by sintering a ceramic greensheet containing a ceramic powder, an organic solvent, and an organicbinder. The ceramic powder, which is a material having highpermittivity, may be a barium titanate (BaTiO₃) based material, astrontium titanate (SrTiO₃) based material, or the like, but is notlimited thereto.

That is, the dielectric layer 111 configuring the first ceramic body 110may contain a ferroelectric material, but is not necessarily limitedthereto.

Meanwhile, according to the first exemplary embodiment in the presentdisclosure, the internal electrodes may include first internalelectrodes 121 exposed to the first end surface of the composite body300 in the length direction and second internal electrodes 122 exposedto the second end surface thereof in the length direction, but theinternal electrodes are not necessarily limited thereto.

The first and second internal electrodes 121 and 122 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oralloys thereof, but is not limited thereto.

The first and second internal electrodes 121 and 122 may be printed onthe ceramic green sheets forming the dielectric layers 111, using theconductive paste by a printing method such as screen printing method ora gravure printing method.

The first ceramic body 110 may be formed by alternately stacking andsintering the ceramic green sheets on which the internal electrode isprinted.

The plurality of first and second internal electrodes 121 and 122 may bedisposed to be horizontal to the upper and lower surfaces of the firstceramic body 110.

Meanwhile, the first and second external electrodes 131 and 132 may beformed of a conductive paste including a conductive metal, wherein theconductive metal may be nickel (Ni), copper (Cu), palladium (Pd), gold(Au), or alloys thereof, but is not limited thereto.

Further, nickel/tin (Ni/Sn) plating layers may be further disposed onthe first and second external electrodes 131 and 132.

In the exemplary embodiment in the present disclosure, the length of themultilayer ceramic capacitor 100 may be 2.0 mm or more.

That is, in the composite electronic component according to theexemplary embodiment in the present disclosure, the multilayer ceramiccapacitor may be applied to the product having a length of at least 2.0mm or more rather than the miniaturized component.

For example, in the exemplary embodiment in the present disclosure, themultilayer ceramic capacitor 100 may have a 2012 size (length: 2.0mm×width: 1.2 mm), a 3216 size (length: 3.2 mm×width: 1.6 mm) or more.

According to the first exemplary embodiment in the present disclosure,the ceramic chip 200 may be coupled to the lower portion of themultilayer ceramic capacitor 100 to thereby be disposed thereon.

In the ceramic chip 200, the first and second terminal electrodes 231and 232 connected to the first and second external electrodes 131 and132 may be disposed on both end portions of the second ceramic body 210formed of a bulk shaped ceramic material.

In general, in order to significantly decrease the transferring ofvibration of a multilayer ceramic capacitor to a printed circuit board,there was an attempt to insert an intermediate medium between themultilayer ceramic capacitor and the printed circuit board.

However, since the intermediate medium is formed of a material havingelasticity, e.g., a resin generally used to manufacture a printedcircuit board, the intermediate medium may serve to absorb vibration ofthe multilayer ceramic capacitor through elasticity of the intermediatemedium.

On the contrary, according to the first exemplary embodiment in thepresent disclosure, since the second ceramic body 210 of the ceramicchip 200 is formed of a hard ceramic material that is not elasticallydeformed, the printed circuit board and the multilayer ceramic capacitor100 may be spaced apart from each other by the ceramic chip 200, therebyblocking vibration generated in the multilayer ceramic capacitor 100from being transferred to the board.

According to the first exemplary embodiment in the present disclosure,the ceramic material having substantially no piezoelectric property. Forexample, the ceramic material may contain alumina (Al₂O₃). As referredto herein, a material having substantially no piezoelectric propertymeans that no measurable deformation is caused in the material whenvoltages typically applied to capacitors in electronic devices areapplied to the material.

Since alumina (Al₂O₃) does not have a piezoelectric property, a ceramicchip containing alumina may suppress vibration generated in themultilayer ceramic capacitor 100 from being transferred, such that theceramic chip 200 containing alumina (Al₂O₃) is disposed on the lowerportion of the multilayer ceramic capacitor 100 to decrease acousticnoise.

Although not particularly limited, the first and second terminalelectrodes 231 and 232 may have, for example, a double layer structurecomposed of first and second conductive resin layers at inner portionsthereof and first and second plating layers at outer portions thereof.

According to the first exemplary embodiment in the present disclosure,since the first and second terminal electrodes 231 and 232 have thedouble layer structure composed of the first and second conductive resinlayers at the inner portions thereof and the first and second platinglayers at the outer portions thereof, when mechanical stress is appliedthereto from the outside, the ceramic chip 200 and the conductive resinlayers used as the terminal electrodes 231 and 232 of the ceramic chip200 may suppress stress from being transferred to the multilayer ceramiccapacitor 100, thereby preventing the multilayer ceramic capacitor frombeing damaged by cracks.

The first and second conductive resin layers may contain a conductivemetal and a thermosetting resin, for example, silver (Ag) and an epoxyresin, but are not limited thereto.

FIG. 3 is a partially cut-away perspective view schematicallyillustrating a multilayer ceramic capacitor according to a secondexemplary embodiment in the present disclosure in the compositeelectronic component of FIG. 1.

In the multilayer ceramic capacitor according to the second exemplaryembodiment in the present disclosure, a plurality of first and secondinternal electrodes 121 and 122 may be disposed to be perpendicular toupper and lower surfaces of a first ceramic body 110.

That is, the first and second internal electrodes 121 and 122 may bestacked to be perpendicular to amounting surface of the composite body300 at the time of mounting the composite body 300 on a printed circuitboard.

In general, when a voltage is applied to a multilayer ceramic capacitor,a ceramic body may be repeatedly expanded and contracted in length,width, and thickness directions due to an inverse piezoelectric effectof dielectric layers.

That is, in a case of actually measuring displacement amounts of asurface (LW surface) of the ceramic body in a length-width direction, asurface (WT surface) of the ceramic body in a width-thickness direction,and a surface (LT surface) of the ceramic body in a length-thicknessdirection using a laser doppler vibrometer (LDV), the displacementamount is decreased in a sequence of the LW surface, the WT surface, andthe LT surface.

The displacement amount of the LT surface is about 42% or so, based onthat of the WT surface, such that the displacement amount of the LTsurface may be smaller than that of the WT surface. The reason may bethat stress having the same magnitude is generated in the LT surface andthe WT surface, but particularly, since the LT surface has a relativelywide area as compared to the WT surface, stress having a similarmagnitude may be distributed throughout the wide area, such thatrelatively small deformation may occur.

Therefore, it may be appreciated that in the general multilayer ceramiccapacitor, the displacement amount is the smallest in the LT surface.

That is, according to the exemplary embodiment in the presentdisclosure, the first and second internal electrodes 121 and 122 may bestacked to be perpendicular to the upper and lower surfaces of the firstceramic body 110, such that at the time of mounting the composite body300 on the printed circuit board, the first and second internalelectrodes 121 and 122 may be disposed to be perpendicular to themounting surface, thereby significantly decreasing a vibration amount ofa surface of the first ceramic body 110 coming in contact with theceramic chip 200.

FIG. 4 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of the compositeelectronic component of FIG. 1.

The composite body 300 may be formed by coupling the multilayer ceramiccapacitor 100 and the ceramic chip 200 to each other, and a method offorming the composite body 300 is not particularly limited.

The composite body 300 may be formed by coupling the multilayer ceramiccapacitor 100 and the ceramic chip 200 that are separately manufacturedto each other using a high-melting point solder, a conductive adhesive213, or the like.

The conductive adhesive 213 may be a paste containing a conductive metaland an epoxy resin, but is not necessarily limited thereto.

Referring to FIG. 4, in a case of coupling the multilayer ceramiccapacitor 100 and the ceramic chip 200 using the high-melting pointsolder, the conductive adhesive 213, or the like, the conductive paste213 may be applied onto the lower surfaces of the first and secondexternal electrodes 131 and 132 to thereby be adhered to the first andsecond terminal electrodes 231 and 232 of the ceramic chip 200.

The high-melting point solder or the conductive adhesive 213 may beapplied onto the lower surfaces of the first and second externalelectrodes 131 and 132 to thereby be fixed to the ceramic chip 200 atthe lower surface of the multilayer ceramic capacitor 100, such thatonly vibration of the surface (LW surface) of the first ceramic body 110in the length-width direction may be transferred to the ceramic chip200.

Therefore, the transferring of stress and vibration generated in themultilayer ceramic capacitor to the ceramic chip may be significantlydecreased, such that acoustic noise may be decreased.

FIG. 5 is an exploded perspective view separately illustrating amultilayer ceramic capacitor and a ceramic chip of another example ofthe composite electronic component of FIG. 1.

Referring to FIG. 5, the high-melting point solder or the conductiveadhesive 213 may be applied to a portion of the upper surface of theceramic chip 200, an adhesion surface of the ceramic chip 200 adhered tothe multilayer ceramic capacitor 100, to thereby be fixed to the ceramicchip 200 at the lower surface of the multilayer ceramic capacitor 100.

In a case in which the conductive adhesive 213 is applied to the entireupper surface of the ceramic chip 200, the adhesion surface of theceramic chip 200 adhered to the multilayer ceramic capacitor 100, asdescribed above, the effect of decreasing acoustic noise may be improveddue to elasticity of the conductive adhesive 213.

Further, since the adhesive is applied to the entire adhesion surface,at the time of mounting the composite electronic component in a board,binding strength of the composite electronic component may be improved,such that reliability may be improved.

FIG. 6 is a perspective view schematically illustrating a compositeelectronic component according to a third exemplary embodiment of thepresent disclosure.

Referring to FIG. 6, in the composite electronic component according tothe third exemplary embodiment in the present disclosure, a length of aceramic chip 200′ may be longer than that of a multilayer ceramiccapacitor 100, and a width of the ceramic chip 200′ may be wider thanthat of the multilayer ceramic capacitor 100.

The ceramic chip 200′ may include a second ceramic body 210′ formed of aceramic material and first and second terminal electrodes 231′ and 232′disposed on both end portions of the second ceramic body 210′ andconnected to first and second external electrodes 131 and 132.

Since the length of the ceramic chip 200′ is longer than that of themultilayer ceramic capacitor 100, and the width of the ceramic chip 200′is wider than that of the multilayer ceramic capacitor 100, at the timeof mounting the composite electronic component on a printed circuitboard, the ceramic chip 200′ may serve to block a solder from beingconnected up to the multilayer ceramic capacitor 100 in length and widthdirections of the multilayer ceramic capacitor 100.

Therefore, the transferring of vibration to the printed circuit board bythe solder may be further decreased.

FIG. 7 is a perspective view schematically illustrating a compositeelectronic component according to a fourth exemplary embodiment in thepresent disclosure.

Referring to FIG. 7, in the composite electronic component according tothe fourth exemplary embodiment in the present disclosure, a length of aceramic chip 200″ may be shorter than that of a multilayer ceramiccapacitor 100, and a width of the ceramic chip 200″ may be wider thanthat of the multilayer ceramic capacitor 100.

The ceramic chip 200″ may include a second ceramic body 210″ formed of aceramic material and first and second terminal electrodes 231″ and 232″disposed on both end portions of the second ceramic body 210″ andconnected to first and second external electrodes 131 and 132.

Since the length of the ceramic chip 200″ is shorter than that of themultilayer ceramic capacitor 100, and the width of the ceramic chip 200″is wider than that of the multilayer ceramic capacitor 100, at the timeof mounting the composite electronic component on a printed circuitboard, the ceramic chip 200″ may serve to allow solder to be appliedonly up to lower surfaces of the first and second external electrodes131 and 132 in a length direction of the multilayer ceramic capacitor100 and block the solder from being connected up to the multilayerceramic capacitor 100 due to a step in a width direction thereof.

That is, since the length of the second ceramic chip 200″ is shorterthan that of the multilayer ceramic capacitor 100, a so-called solderpocket blocking the solder from rising up to the first and secondexternal electrodes 131 and 132 in the length direction of themultilayer ceramic capacitor 100 may be formed.

In this structure, at the time of mounting the composite electroniccomponent on a printed circuit board, the solder may only be applied upto the lower surfaces of the first and second external electrodes 131and 132 in the length direction of the multilayer ceramic capacitor 100.

Therefore, the transferring of vibration to the printed circuit board bythe solder may be further decreased.

FIG. 8 is a perspective view schematically illustrating a compositeelectronic component according to a fifth exemplary embodiment in thepresent disclosure.

Referring to FIG. 8, in the composite electronic component according tothe fifth exemplary embodiment in the present disclosure, a length of aceramic chip 200′″ may be shorter than that of a multilayer ceramiccapacitor 100, and a width of the ceramic chip 200′″ may be narrowerthan that of the multilayer ceramic capacitor 100.

The ceramic chip 200′″ may include a second ceramic body 210′″ formed ofa ceramic material and first and second terminal electrodes 231′″ and232′″ disposed on both end portions of the second ceramic body 210′″ andconnected to first and second external electrodes 131 and 132.

Since the length of the ceramic chip 200′″ is shorter than that of themultilayer ceramic capacitor 100, and the width of the ceramic chip200′″ is narrower than that of the multilayer ceramic capacitor 100, atthe time of mounting the composite electronic component on a printedcircuit board, the ceramic chip 200′″ may serve to allow the solder tobe applied only up to lower surfaces of the first and second externalelectrodes 131 and 132 in length and width directions of the multilayerceramic capacitor 100, and block the solder from being connected up tothe multilayer ceramic capacitor 100 in a thickness direction thereof.

Therefore, the transferring of vibration to the printed circuit board bythe solder may be further decreased.

Board Having Composite Electronic Component

FIG. 9 is a perspective view illustrating a board in which the compositeelectronic component of FIG. 1 is mounted on a printed circuit boar.

FIG. 10 is a cross-sectional view taken along line II-II′ of FIG. 9.

Referring to FIGS. 9 and 10, a board 400 having a composite electroniccomponent according to the present exemplary embodiment may include aprinted circuit board 410 and two electrode pads 421 and 422 formed onan upper surface of the printed circuit board 410.

The electrode pads 421 and 422 may be composed of first and secondelectrode pads 421 and 422 connected to the first and second terminalelectrodes 231 and 232 of the ceramic chip 200 of the compositeelectronic component, respectively.

In this case, the first and second terminal electrodes 231 and 232 ofthe ceramic chip 200 may be electrically connected to the printedcircuit board 410 by solder 430 in a state in which first and secondterminal electrodes 231 and 232 are positioned to contact the first andsecond electrode pads 421 and 422, respectively.

When a voltage is applied in a state in which the composite electroniccomponent is mounted on the printed circuit board 410 as describedabove, acoustic noise may be generated.

That is, when voltages having different polarities are applied to thefirst and second external electrodes 131 and 132 disposed on both endsurfaces of the multilayer ceramic capacitor 100 of the compositeelectronic component in the length direction in a state in which thecomposite electronic component is mounted on the printed circuit board410, the first ceramic body may be expanded and contracted in thethickness direction by an inverse piezoelectric effect of the dielectriclayer 111, and both side portions of the first and second externalelectrodes 131 and 132 may be contracted and expanded by a Poissoneffect as opposed to expansion and contraction of the first ceramic body110 in the thickness direction.

Here, in the composite electronic component according to the exemplaryembodiment in the present disclosure, the ceramic chip 200 may bedisposed on the lower portion of the multilayer ceramic capacitor 100,such that at the time of mounting the composite electronic component onthe printed circuit board, a problem that the solder rises up to thefirst and second external electrodes 131 and 132 of the multilayerceramic capacitor 100 may be prevented, thereby blocking piezoelectricstress from being directly transferred from the multilayer ceramiccapacitor 100 to the printed circuit board through the first and secondexternal electrodes 131 and 132. Therefore, acoustic noise may befurther decreased.

That is, at the time of mounting the composite electronic component onthe printed circuit board, the transferring of vibrations of thecapacitor due to the inverse piezoelectric property of the capacitor tothe printed circuit board may be decreased, such that acoustic noise maybe decreased.

Hereafter, although the present disclosure will be described in detailwith reference to Inventive Examples, the present disclosure is notlimited thereto.

Experimental Example

Composite electronic components according to Inventive Examples andComparative Examples were manufactured as follows.

In Inventive Examples and Comparative Examples according to the presentdisclosure, a ceramic chip was disposed on a lower portion of amultilayer ceramic capacitor, and a composite electronic component wasmanufactured depending on a length of the multilayer ceramic capacitorand a mounting form of internal electrodes. Acoustic noise levelsdepending on a ratio (T/L) of a thickness T of a second ceramic chip 200to a length L of the multilayer ceramic capacitor 100 was compared.

More specifically, the following [Table 1] illustrates results obtainedby comparing acoustic noise levels when the length of the multilayerceramic capacitor was 2.078 mm and the internal electrodes were stackedto be horizontal to a mounting surface of a printed circuit board.

In Comparative Examples 1 to 4 and Inventive Examples 1 to 3, each 5samples were manufactured and tested, and an average value obtained bytesting acoustic noise levels in each 5 samples was represented as theacoustic noise level.

TABLE 1 Thickness (mm) of Acoustic Noise Ceramic Chip T/L (dBA)Comparative 0.25 0.12 41.56 Example 1 Comparative 0.3 0.14 40.86 Example2 Comparative 0.35 0.17 42.48 Example 3 Comparative 0.4 0.19 41.40Example 4 Inventive 0.45 0.22 37.00 Example 1 Inventive 0.5 0.24 36.56Example 2 Inventive 0.65 0.31 36.44 Example 3

Referring to Table 1, in Comparative Examples 1 to 4 in which the ratio(T/L) of the thickness T of the second ceramic chip 200 to the length Lof the multilayer ceramic capacitor 100 was less than 0.22, the acousticnoise level was measured to be 41.40 dBA or more.

On the contrary, In Inventive Examples 1 to 3 in which the ratio (T/L)of the thickness T of the second ceramic chip 200 to the length L of themultilayer ceramic capacitor 100 was 0.22 or more, the acoustic noiselevel was measured to be 37.00 dBA or less. Therefore, it may beappreciated that the acoustic noise level was decreased.

The following [Table 2] illustrates results obtained by comparingacoustic noise levels when the length of the multilayer ceramiccapacitor was 2.078 mm and the internal electrodes were stacked to beperpendicular to a mounting surface of a printed circuit board.

In Comparative Examples 1 to 2 and Inventive Examples 1 to 3, each 5samples were manufactured and tested, and an average value obtained bytesting acoustic noise levels in each 5 samples was represented as theacoustic noise level.

TABLE 2 Thickness (mm) of Acoustic Noise Ceramic Chip T/L (dBA)Comparative 0.25 0.12 37.25 Example 1 Comparative 0.4 0.19 35.90 Example2 Inventive 0.45 0.22 31.26 Example 1 Inventive 0.5 0.24 28.74 Example 2Inventive 0.65 0.31 28.62 Example 3

Referring to Table 2, it may be appreciated that the acoustic noiselevels were low as compared to those in Table 1. That is, it may beappreciated that according to the exemplary embodiment in the presentdisclosure, in a structure in which the internal electrodes disposed inthe multilayer ceramic capacitor were stacked to be perpendicular to themounting surface of the printed circuit board, the effect of decreasingacoustic noise was more excellent as compared to a structure in whichthe internal electrodes were stacked to be horizontal thereto.

In Comparative Examples 1 and 2 in which the ratio (T/L) of thethickness T of the second ceramic chip 200 to the length L of themultilayer ceramic capacitor 100 was less than 0.22, the acoustic noiselevel was measured to be 35.90 dBA or more.

On the contrary, In Inventive Examples 1 to 3 in which the ratio (T/L)of the thickness T of the second ceramic chip 200 to the length L of themultilayer ceramic capacitor 100 was 0.22 or more, the acoustic noiselevel was measured to be 31.26 dBA or less. Therefore, it may beappreciated that the acoustic noise level was decreased.

The following [Table 3] illustrates results obtained by comparingacoustic noise levels when the length of the multilayer ceramiccapacitor was 3.346 mm and the internal electrodes were stacked to behorizontal to amounting surface of a printed circuit board.

In Comparative Examples 1 to 3 and Inventive Examples 1 and 2, each 5samples were manufactured and tested, and an average value obtained bytesting acoustic noise levels in each 5 samples was represented as theacoustic noise level.

TABLE 3 Thickness (mm) of Acoustic Noise Ceramic Chip T/L (dBA)Comparative 0.25 0.07 43.12 Example 1 Comparative 0.45 0.13 41.32Example 2 Comparative 0.6 0.18 42.04 Example 3 Inventive 0.75 0.22 35.42Example 1 Inventive 0.9 0.27 33.74 Example 2

Referring to Table 3, in Comparative Examples 1 to 3 in which the ratio(T/L) of the thickness T of the second ceramic chip 200 to the length Lof the multilayer ceramic capacitor 100 was less than 0.22, the acousticnoise level was measured to be 42.04 dBA or more.

On the contrary, In Inventive Examples 1 and 2 in which the ratio (T/L)of the thickness T of the second ceramic chip 200 to the length L of themultilayer ceramic capacitor 100 was 0.22 or more, the acoustic noiselevel was measured to be 35.42 dBA or less. Therefore, it may beappreciated that the acoustic noise level was decreased.

As set forth above, according to exemplary embodiments in the presentdisclosure, stress or vibrations due to the piezoelectric property ofthe multilayer ceramic capacitor may be alleviated by the ceramic chip,such that the acoustic noise generated in the printed circuit board maybe decreased.

Particularly, the effect of decreasing acoustic noise may besignificantly increased by optimizing the ratio of the size of themultilayer ceramic capacitor and the thickness of the ceramic chip.

Further, the internal electrodes of the multilayer ceramic capacitor maybe stacked perpendicularly to the mounting surface of the compositebody, and the surface of the first ceramic body in the length-widthdirection of which a piezoelectric displacement amount is small may beadhered to the ceramic chip, such that the transferring of stress andvibration generated in the multilayer ceramic capacitor to the ceramicchip may be significantly decreased, thereby decreasing acoustic noise.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A composite electronic component comprising acomposite body in which a multilayer ceramic capacitor and a ceramicchip are coupled to each other, the multilayer ceramic capacitorincluding a first ceramic body in which a plurality of dielectric layersand internal electrodes disposed to face each other with respectivedielectric layers interposed therebetween are stacked, and first andsecond external electrodes disposed on both end portions of the firstceramic body, and the ceramic chip being disposed on a lower portion ofthe multilayer ceramic capacitor and including a ceramic materialcontaining alumina (Al₂O₃), wherein the ceramic chip has an uppersurface on which the multilayer ceramic capacitor is disposed and alower surface opposing the upper surface, the upper surface and thelower surface of the ceramic chip being connected to end surfaces of theceramic chip which oppose each other in a length direction of theceramic chip, the upper surface and the lower surface of the ceramicchip being also connected to side surfaces of the ceramic chip whichoppose each other in a width direction of the ceramic chip, whereinT/L≥0.22 and T is 0.9 mm or less, in which L is a length L of themultilayer ceramic capacitor and T is a thickness of the ceramic chip,wherein a length of the ceramic chip is longer than that of themultilayer ceramic capacitor, wherein the ceramic chip includes a firstterminal electrode disposed only on the upper surface, the lowersurface, one of the end surfaces, and the side surfaces of the ceramicchip and connected to the first external electrode, and a secondterminal electrode disposed only on the upper surface, the lowersurface, the other of the end surfaces, and the side surfaces of theceramic chip and connected to the second external electrode, and whereinthe first and second terminal electrodes each include a double layerstructure composed of a conductive resin layer at an inner portionthereof and a plating layer at an outer portion thereof.
 2. Thecomposite electronic component of claim 1, further comprising: a firstconductive adhesive connecting the first terminal electrode to the firstexternal electrode, the first conductive adhesive disposed on the firstterminal electrode and extending onto a first region of the ceramic chipoutside the first terminal electrode; and a second conductive adhesiveconnecting the second terminal electrode to the second externalelectrode, the second conductive adhesive disposed on the secondterminal electrode and extending onto a second region of the ceramicchip outside the second terminal electrode.
 3. The composite electroniccomponent of claim 1, wherein L is 2.0 mm or more, and T is 0.5 mm ormore.
 4. The composite electronic component of claim 1, wherein L is 2.0mm or more and T is 0.45 mm or more.
 5. A composite electronic componentcomprising a composite body in which a multilayer ceramic capacitor anda ceramic chip are coupled to each other, the multilayer ceramiccapacitor including a first ceramic body in which a plurality ofdielectric layers and internal electrodes disposed to face each otherwith respective dielectric layers interposed therebetween are stacked,and first and second external electrodes disposed on both end portionsof the first ceramic body, and the ceramic chip being disposed on alower portion of the multilayer ceramic capacitor and including of aceramic material containing alumina (Al₂O₃), wherein the ceramic chiphas an upper surface on which the multilayer ceramic capacitor isdisposed and a lower surface opposing the upper surface, the uppersurface and the lower surface of the ceramic chip being connected to endsurfaces of the ceramic chip which oppose each other in a lengthdirection of the ceramic chip, the upper surface and the lower surfaceof the ceramic chip being also connected to side surfaces of the ceramicchip which oppose each other in a width direction of the ceramic chip,wherein T/L≥0.22 and T is 0.9 mm or less, in which L is a length L ofthe multilayer ceramic capacitor and T is a thickness of the ceramicchip, wherein a width of the ceramic chip is wider than that of themultilayer ceramic capacitor, wherein the ceramic chip includes a firstterminal electrode disposed only on the upper surface, the lowersurface, one of the end surfaces, and the side surfaces of the ceramicchip and connected to the first external electrode, and a secondterminal electrode disposed only on the upper surface, the lowersurface, the other of the end surfaces, and the side surfaces of theceramic chip and connected to the second external electrode, and whereinthe first and second terminal electrodes each include a double layerstructure composed of a conductive resin layer at an inner portionthereof and a plating layer at an outer portion thereof.
 6. Thecomposite electronic component of claim 5, further comprising: a firstconductive adhesive connecting the first terminal electrode to the firstexternal electrode, the first conductive adhesive disposed on the firstterminal electrode and extending onto a first region of the ceramic chipoutside the first terminal electrode; and a second conductive adhesiveconnecting the second terminal electrode to the second externalelectrode, the second conductive adhesive disposed on the secondterminal electrode and extending onto a second region of the ceramicchip outside the second terminal electrode.
 7. The composite electroniccomponent of claim 5, wherein L is 2.0 mm or more, and T is 0.5 mm ormore.
 8. The composite electronic component of claim 5, wherein T is0.75 mm or more.
 9. The composite electronic component of claim 5,wherein L is 2.0 mm or more and T is 0.45 mm or more.
 10. A compositeelectronic component comprising a composite body in which a multilayerceramic capacitor and a ceramic chip are coupled to each other, themultilayer ceramic capacitor including a first ceramic body in which aplurality of dielectric layers and internal electrodes disposed to faceeach other with respective dielectric layers interposed therebetween arestacked, and first and second external electrodes disposed on both endportions of the first ceramic body, and the ceramic chip being disposedon a lower portion of the multilayer ceramic capacitor and formed of aceramic material containing alumina (Al₂O₃), wherein the ceramic chiphas an upper surface on which the multilayer ceramic capacitor isdisposed and a lower surface opposing the upper surface, the uppersurface and the lower surface of the ceramic chip being connected to endsurfaces of the ceramic chip which oppose each other in a lengthdirection of the ceramic chip, the upper surface and the lower surfaceof the ceramic chip being also connected to side surfaces of the ceramicchip which oppose each other in a width direction of the ceramic chip,wherein T/L≥0.22, in which L is a length L of the multilayer ceramiccapacitor, and T is a thickness of the ceramic chip and is 0.75 mm ormore and 0.9 mm or less, wherein a length of the ceramic chip is longerthan that of the multilayer ceramic capacitor, and wherein the ceramicchip includes a first terminal electrode disposed only on the uppersurface, the lower surface, one of the end surfaces, and the sidesurfaces of the ceramic chip and connected to the first externalelectrode, and a second terminal electrode disposed only on the uppersurface, the lower surface, the other of the end surfaces, and the sidesurfaces of the ceramic chip and connected to the second externalelectrode.
 11. The composite electronic component of claim 10, wherein Lis 2.0 mm or more.